Multifinger Imaging Tool (MIT)
The Sondex Wireline Multifinger Imaging Tool (MIT), comprising downhole tools, surface equipment and software, provides high resolution detail on the condition of downhole tubulars. The downhole MIT has an array of hard surfaced fingers which measure very small changes in diameter. A range of tool sizes with 24, 40, or 60 fingers are available to suit different casing diameters. Tool deployment can be via slickline, electric line, coiled tubing or Downhole Tractors. In surface readout mode, a digital surface panel supplies power to the toolstring and decodes the telemetry signals received. In memory mode, a PC and memory interface unit are required.
Features & Benefits
- Available in 24 or 60 finger versions
- Surface Read Out or Memory options
- Combinable with other Ultrawire™ tools
- 3D data analysis using WIVA software
- Statistical analysis using WIPER software
- Suitable for all well deviations
- Extended finger lengths available for all tools (optional)
- Simultaneous use with other PL tools